• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A chip cover is disclosed for totally or partially covering an electrical, electronic, optoelectronic or electromechanical chip component. The chip cover is provided with an activator which, in the activated state, can destroy the electrical, electronic, optoelectronic or electromechanical chip components in whole or in part and which can be activated by an attempt to remove the chip cover from the chip. Is distinguished from. In this way, reverse processing or manipulation to the chip can be reliably prevented.
    公开号:KR19990008167A
    申请号:KR1019970707692
    申请日:1996-04-09
    公开日:1999-01-25
    发明作者:데틀레프 후도이；요제프 키르쉬바우어；크리스틀 니델레；페터 슈탐프카；한스-힌네르크 슈테칸
    申请人:로더리히네테부쉬；지멘스악티엔게젤샤프트；
    IPC主号:
    专利说明:

    Chip cover
    This type of chip cover protects the covered area of the chip from damage due to mechanical forces and ambient conditions.
    In chips provided on a chip card such as a smart card, so far, the chip cover can be removed by, for example, chemical methods (for example, using HNO 3 ), so that accurate chip circuit analysis and manipulation of the chip circuit are performed. It can be done relatively easily.
    Since this causes the possibility of misuse, the possibility of performing such an analysis or manipulation of the chip circuit is undesirable.
    As such an example, a chip card or a smart card that can be used in the pay television sector may be mentioned. If Hecker succeeded in analyzing the chip circuits accessible by a particular television channel with respect to the location and function or interconnection of the individual elements in the circuit, and gained the ability to manipulate them by suitable jumpers, etc. He will be available for a free service.
    This possibility of manipulation is important not only for the paying television sector, but also for all types of chips used for access control, which opens up unlimited possibilities for misuse, which creates not only financial losses but also considerable confidentiality risks. .
    The present invention relates to chip covers for total or partial protection of electrical, electronic, optoelectronic or electromechanical chip components.
    1 shows two chips with one chip on another.
    It is therefore an object of the present invention to provide a chip cover according to the preamble of claim 1 in such a way that reverse processing or manipulation of the chip can be reliably prevented.
    This object is achieved in accordance with the invention as claimed in the preamble of claim 1.
    Thus, in the activated state, an activator is provided which can destroy the electrical, electronic, optoelectronic or electromechanical chip components in whole or in part and which can be activated by attempting to remove the chip cover from the chip.
    As a result, there is a possibility that destruction of the chip area associated with the airtight protection occurs at the same time as the chip cover is removed.
    Reverse processing and manipulation of the chip can be reliably prevented.
    Useful refinements concerning the invention constitute the main problem of the dependent claims.
    The invention is explained in more detail using the detailed embodiments with reference to the drawings.
    Fig. 1 shows two chips with one chip on top of another, with the area associated with the tight protection of the chip covered by a chip cover according to a practical embodiment of the invention. Although the compartment is marked, the shading is removed for the purpose of cleanliness.
    In Fig. 1, reference numeral 1 denotes a first chip which is not cased in the form of a controller. As an example, the Siemens module SLE 44C20 with ROM, PROM, EEPROM and RAM can be used as the controller.
    The first chip is fixed on the system support 3 by the adhesive layer 2.
    The system support 3 may be a plastic card for producing a chip card or a smart card, for example, and may also be a flexible printed circuit board (PCB) or so-called lead frame.
    The interconnection 4 of aluminum extends above the surface, which is the upper surface of the first chip on the drawing.
    The interconnect 4 is covered by a first chip cover layer in the form of a silicon nitride (Si 3 N 4 ) layer 5. The purpose of this layer 5 is to protect the chip from damage caused by ambient conditions, in particular moisture and moisture.
    On top of the Si 3 N 4 layer 5 a second chip cover layer is provided in the form of a polyimide layer 6. The polyimide layer 6 protects the underlying chip structure from mechanical damage.
    A recess in which the exposed aluminum contact point 7 (Al pad) is located is provided on the chip cover layers 5 and 6.
    On top of the first chip, a second uncased chip 8 is provided in the form of an Application Specific Integrated Circuit (ASIC) module.
    The second chip 8 is bonded by an adhesive layer 9 on the polyimide layer 6 described above.
    Similarly the second chip comprises an aluminum contact point 7 on the side of the chip located on the upper side of the figure.
    The contact point of the first chip and the contact point of the second chip are connected to each other by a bonding wire 10.
    The entire device described above is enclosed in the form of a so-called glove top 11 with a third chip cover layer, the purpose of which is to protect the device from ambient conditions and mechanical damage. In the case presented, the glove top 11 is composed of epoxy resin.
    The device described above and shown in FIG. 1 is part of a chip card, such as a smart card.
    In general, the first to third chip cover layers 5, 6 and 11 and the adhesive layers 2, 8 are composed of a material that can be chemically removed. For example, fuming HNO 3 is suitable for this, because even if it damages the chip cover, it does not destroy the interconnection points 4 and the contacts 7 made of aluminum.
    In order to protect this from providing the possibility of reverse processing or manipulation of the area associated with the airtightness of the chip, an activator in the chip cover is provided on top of this area.
    In the case of a chip card such as a smart card, the area related to stability protected from reverse processing or manipulation by using chips arranged one on top of the other is generally the controller chip 1 laid down. Such areas may also be areas related to the stability of the presented practical embodiments.
    In the examples shown, the activator is a substance that is activated when it comes into contact with a solvent form material such as etchant which chemically dissolves the chip cover, ie when it comes into contact with fuming HNO 3 , for example. Upon activation, a substance with a reducing action is released, which destroys such a chip structure made of aluminum, for example interconnect 4, thereby making it impossible to reverse process or manipulate the area associated with hermetic protection. Let's do it.
    In the deactivated state, the activator does not damage the chip.
    In the practical example shown, the breakdown of the chip structure after activation of the activator occurs by dissolving this structure by chemical reduction.
    In the practical examples shown, the activator is formed of RCl 2 . When contacted with HNO 3 , free groups are formed according to the following reactions, and as a result of reducing their properties, these free groups destroy the aluminum structures located under the chip cover.
    HNO 3 + RCl 2 → 2Cl - +... …
    Since the oxidizing material affects aluminum only until the aluminum structure is coated with the oxide layer, an activator that releases the oxidizing material in contact with HNO 3 does not produce a desirable result here, and the oxide layer has a self-protecting function. To the aluminum structure and does not cause destruction of the aluminum structure at all.
    The activator indicated by reference numeral 12 in FIG. 1 is provided on top of the airtight protective sensing region in the gap or recess in the form of a window, the region of which is made of Si 3 N 4 layer 5 or polyimide layer 6 thereof. Exposed to the end. When a chip card such as a smart card is manufactured, the active body is enclosed by the chip cover in this gap or recess.
    As an alternative to this, the activator may also be incorporated into the polyimide matrix.
    In the deactivated state, it is not required that the activator be contacted with aluminum, which is destroyed at a suitable time. The position of the activator must be made to suit a variety of needs or for each chip.
    The type of activator is preferably made to match the chemicals used to dissolve the chip cover, so that when a solvent encounters the activator, the desired activation of the activator is reliably initiated.
    However, so long as the analysis or manipulation of the chip is thereby prevented, the effect of the activation is selected in a preferred manner. Instead of destroying the above-mentioned aluminum by chemical reduction, it can be prepared to destroy the chip by providing thermal energy or the like, for example.
    Since a plurality of different activators are prepared, each reacting with a different solvent as required, the best diversified type of solvent activates each of the at least one activator individually.
    Other materials capable of activating the activator as desired may also be provided separately from the activator in the same way as the activator in addition to the activator in the chip cover. Therefore, when the chip cover is removed, both the activator and the material activating the activator on demand are released, so that the activator material can be selected separately from the required solvent.
    The last mentioned possibility offers the advantage that destruction of the chip structure associated with confidentiality occurs when attempts are made to make this structure accessible by using non-chemical means.
    If there is an attempt to make this accessible by removing the chip cover, the provision of the above-mentioned activator in the chip cover enables the area of the chip associated with the confidentiality to be automatically destroyed.
    Considering that the structure to be broken in this case has an extremely small area, the amount of activator which must be provided correspondingly to the positioning is similarly extremely small.
    A further method for increasing the confidentiality against the reverse processing or manipulation of the chip is that the chip associated with the least confidentiality, ie the ASIC chip 2 in the present embodiment, is placed exactly above the area associated with the confidentiality of the other chip. In other words, in the presented embodiment it consists of arranging precisely on top of the area associated with the highest confidentiality of the controller chip 1. Because of the lack of optical accessibility, the possibility that the chip can be analyzed or manipulated without removing the cover is also ruled out by this.
    The practical embodiments described above relate to chips on chips on so-called flexible structures using chip and wire connection techniques. It is evident that the present invention is not limited to this structure, but may be used in the case of a single chip and in the case of a plurality of chips connected arbitrarily arranged in a preferred manner.
    Moreover, there is no limitation of the materials used according to the above description. Such materials may be replaced with any other desired material if the replacement materials fulfill their function in place of the material.
    By the chip cover design according to the present invention described above, reverse processing and manipulation of the chip is reliably and easily prevented regardless of the design of the device.
    Although the present invention has been described above in accordance with one preferred embodiment of the present invention, various modifications may be made without departing from the spirit of the present invention as defined by the appended claims. It is obvious to those skilled in the art.
    权利要求:
    Claims (16)
    [1" claim-type="Currently amended] A chip cover for covering an entirety or part of an electrical, electronic, optoelectronic or electromechanical chip component,
    A chip, characterized in that it comprises an activator which, in an activated state, can completely or partially destroy an electrical, electronic, optoelectronic or electromechanical chip component and which can be activated by an attempt to remove the chip cover from the chip. cover.
    [2" claim-type="Currently amended] 2. The chip cover of claim 1, wherein uncased chips provided on a chip card or smart card can be covered by the cover.
    [3" claim-type="Currently amended] The chip cover of claim 1 or 2, wherein the chip is a controller module or an ASIC module.
    [4" claim-type="Currently amended] 4. A chip cover according to any one of claims 1 to 3, wherein said active body is provided in a recess provided in said chip cover.
    [5" claim-type="Currently amended] 5. The chip cover of claim 1, wherein the active agent is integrated into a cover material matrix. 6.
    [6" claim-type="Currently amended] The chip cover according to any one of claims 1 to 5, wherein the substance having a reducing action is released when the activator is activated.
    [7" claim-type="Currently amended] 7. The chip cover of claim 6, wherein the electrical, optoelectronic or electromechanical chip component is destroyed by a material having the reducing action.
    [8" claim-type="Currently amended] 8. The chip cover of claim 1, wherein the electrical, electronic, optoelectronic or electromechanical chip component is an aluminum structure. 9.
    [9" claim-type="Currently amended] The chip cover according to any one of claims 1 to 8, wherein the activator is RCl 2 .
    [10" claim-type="Currently amended] 10. The chip cover of claim 9, wherein a free group is formed when RCl 2 is solvated.
    [11" claim-type="Currently amended] The chip cover of claim 10, wherein the free group is a material having a reducing effect.
    [12" claim-type="Currently amended] The chip cover according to any one of claims 1 to 11, wherein the activator is activated by a solvent for dissolving the chip cover.
    [13" claim-type="Currently amended] 12. The chip cover of claim 1, wherein the activator is activated by an active agent stored within the chip cover.
    [14" claim-type="Currently amended] 14. A chip cover according to any one of the preceding claims, wherein the second chip is arranged over an area associated with the gas tight protection of the chip.
    [15" claim-type="Currently amended] 15. The chip cover according to any one of the preceding claims, wherein the active material in the chip cover is provided on top of an area associated with the gas tight protection of the chip.
    [16" claim-type="Currently amended] The chip cover according to any one of claims 1 to 15, wherein the chip cover is composed of a plurality of layers.
    类似技术:
    公开号 | 公开日 | 专利标题
    US6821815B2|2004-11-23|Method of assembling a semiconductor chip package
    EP0497948B1|1995-05-03|Method and device for hermetic encapsulation of electronic components
    CA2230009C|2005-05-03|Anti-tamper integrated circuit
    DE102008064723B4|2017-05-11|System for protection of circuit boards against unauthorized intervention
    US7053483B2|2006-05-30|Semiconductor package using terminals formed on a conductive layer of a circuit board
    US7989938B2|2011-08-02|Semiconductor device for fingerprint recognition
    US5535101A|1996-07-09|Leadless integrated circuit package
    DE69725926T2|2004-05-06|Joining method for substrates and structure
    AU626542B2|1992-08-06|Flexible printed circuit
    JP3895768B2|2007-03-22|Vertical interconnect method for silicon segments
    US6444499B1|2002-09-03|Method for fabricating a snapable multi-package array substrate, snapable multi-package array and snapable packaged electronic components
    US7094633B2|2006-08-22|Method for efficiently producing removable peripheral cards
    JP4456066B2|2010-04-28|Active security device with electronic memory
    EP0818132B1|2005-07-20|A method to prevent intrusions into electronic circuitry
    KR0156065B1|1998-12-15|Process for surface mounting filp flop chip carrier modules
    KR101083445B1|2011-11-14|Embedded Package Security Tamper Mesh
    DE3118298C2|1989-09-28|
    EP1415271B1|2005-10-26|Bonding of semiconductor chips in chip cards
    EP0068539B1|1988-01-07|Micropackage for identification card
    KR100332284B1|2002-04-12|Semiconductor device and fabrication method
    US6858799B2|2005-02-22|Electronic component with a semiconductor chip and method of producing the electronic component
    US5041395A|1991-08-20|Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip
    EP0307773B1|1992-01-15|Method of manufacturing electronic modules, especially for smart cards
    US6670221B2|2003-12-30|Semiconductor device having a built-in contact-type sensor and manufacturing method thereof
    US5031026A|1991-07-09|Thin semiconductor card
    同族专利:
    公开号 | 公开日
    CN1135616C|2004-01-21|
    RU2164720C2|2001-03-27|
    DE19515188A1|1996-11-07|
    IN188645B|2002-10-26|
    WO1996034409A1|1996-10-31|
    JPH11504164A|1999-04-06|
    KR100407042B1|2004-02-18|
    DE19515188C2|1998-02-19|
    EP0823129A1|1998-02-11|
    CN1182499A|1998-05-20|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    法律状态:
    1995-04-25|Priority to DE19515188A
    1995-04-25|Priority to DE19515188.7
    1996-04-09|Application filed by 로더리히네테부쉬, 지멘스악티엔게젤샤프트
    1999-01-25|Publication of KR19990008167A
    2004-02-18|Application granted
    2004-02-18|Publication of KR100407042B1
    优先权:
    申请号 | 申请日 | 专利标题
    DE19515188A|DE19515188C2|1995-04-25|1995-04-25|Chip cover|
    DE19515188.7|1995-04-25|
    [返回顶部]